Sivame ukuhlangana ne-BGA soldering empofu enqubweni yenqubo yokuhlanganisa i-PCB ngenxa yokuklama okungalungile kwe-PCB emsebenzini.Ngakho-ke, i-PCBFuture izokwenza isifinyezo kanye nesingeniso kumacala amaningana ezinkinga zokuklama ezivamile futhi ngethemba ukuthi inganikeza imibono ebalulekile kubaklami be-PCB!
Kukhona ikakhulukazi lezi zenzakalo ezilandelayo:
1. I-vias engezansi ye-BGA ayicutshungulwa.
Kukhona ngezimbobo ku-pad ye-BGA, futhi amabhola e-solder alahlekile ne-solder ngesikhathi senqubo yokuhlanganisa;Ukukhiqiza kwe-PCB akusebenzisi inqubo yemaski ye-solder, futhi kubangela ukulahlekelwa kwe-solder namabhola e-solder ngokusebenzisa i-vias eseduze nephedi, okuholela ekutheni amabhola e-solder angabikho, njengoba kuboniswe esithombeni esilandelayo.
2.Imaski ye-BGA solder yakhelwe kabi.
Ukubekwa kwezimbobo ku-PCB pads kuzodala ukulahleka kwe-solder;I-high-density PCB assembly kumele yamukele i-microvia, i-vias eyimpumputhe noma izinqubo zokuxhuma ukugwema ukulahlekelwa kwe-solder;Njengoba kukhonjisiwe esithombeni esilandelayo, isebenzisa i-wave soldering, futhi kukhona ama-vias ezansi kwe-BGA.Ngemva kwe-wave soldering, i-solder ku-vias ithinta ukuthembeka kwe-BGA soldering, okubangela izinkinga ezifana neziyingi ezimfushane zezingxenye.
3. Idizayini yephedi ye-BGA.
Intambo eholayo yephedi ye-BGA akufanele idlule u-50% wobubanzi bephedi, futhi ucingo oluholayo lwephedi yokuphakela amandla akufanele lube ngaphansi kuka-0.1mm, bese luyijiya.Ukuze uvimbele ukuwohloka kwephedi, ifasitela lemaski ye-solder akufanele libe likhulu kuno-0.05mm, njengoba kuboniswe esithombeni esilandelayo.
4.Ubukhulu bephedi ye-PCB BGA abulingani futhi bukhulu kakhulu noma buncane kakhulu, njengoba kukhonjisiwe esithombeni esingezansi.
5. Ama-pads e-BGA anobukhulu obuhlukene, futhi amalunga e-solder ayindilinga engavamile yobukhulu obuhlukahlukene, njengoba kuboniswe emfanekisweni ongezansi.
6. Ibanga eliphakathi komugqa wozimele we-BGA kanye nonqenqema lwengxenye yomzimba liseduze kakhulu.
Zonke izingxenye zezingxenye kufanele zibe phakathi kwebanga lokumaka, futhi ibanga phakathi komugqa wefreyimu kanye nomkhawulo wephakheji lengxenye kufanele libe ngaphezu kwe-1/2 yobukhulu bokugcina be-solder bengxenye, njengoba kuboniswe esithombeni esingezansi.
I-PCBFuture ingumkhiqizi womhlangano we-PCB ne-PCB ongahlinzeka ngokukhiqiza kwe-PCB, ukuhlanganiswa kwe-PCB kanye nezinsiza zokuthola izingxenye.Uhlelo oluphelele lokuqinisekisa ikhwalithi kanye nemishini ehlukahlukene yokuhlola isisiza ukuthi siqaphe yonke inqubo yokukhiqiza, siqinisekise ukuzinza kwale nqubo kanye nekhwalithi yomkhiqizo ophezulu, okwamanje, amathuluzi athuthukile nezindlela zobuchwepheshe zethulwe ukuze sizuze ukuthuthuka okuqhubekayo.
Isikhathi sokuthumela: Feb-02-2021