I-Printed Circuit Board iyitshe legumbi lemikhiqizo ye-elekthronikhi, kubaluleke kakhulu ukuthi imikhiqizo yakho ingasebenza ngokuzinza isikhathi eside noma cha.Njengomkhiqizi ochwepheshe we-PCB kanye ne-PCB Assembly, i-PCBFuture ibeka inani eliphakeme kwikhwalithi yamabhodi wesekethe.
I-PCBFuture iqala ebhizinisini le-PCB Fabrication, bese inwebela kumhlangano we-PCB nezinsiza zokuthola izingxenye, manje isibe omunye womkhiqizi womhlangano we-PCB ongcono kakhulu we-turnkey.Senza imizamo eminingi yokutshala impahla ethuthukisiwe ukuze uthole ubuchwepheshe obungcono, isistimu yangaphakathi ethuthukisiwe ukuze isebenze kangcono, sinikeze amandla abasebenzi ngamakhono angcono.
| Inqubo | Into | Amandla okucubungula | |
| Ulwazi Lwesisekelo | Amandla Okukhiqiza | Ukubalwa kwesendlalelo | 1-30 izingqimba |
| Khothama usonte | 0.75% ejwayelekile, 0.5% ethuthukisiwe | ||
| Okuncane.usayizi we-PCB ophelile | 10 x 10mm(0.4 x 0.4") | ||
| Ubukhulu.usayizi we-PCB ophelile | 530 x 1000mm(20.9 x 47.24 ") | ||
| Ukucindezela okuningi ukuze uthole ama-vias angaboni/angcwatshwe | I-Multi-press Cycle≤3 izikhathi | ||
| Kuqedwe ukujiya kwebhodi | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Iqedile ukubekezelela ukushuba kwebhodi | +/-10% okujwayelekile, +/-0.1mm okuthuthukile | ||
| Ukuqedwa kobuso | I-HASL, i-Lead free HASL, i-Flash gold, i-ENIG, i-Hard gold plating, i-OSP, i-Immersion Tin, isiliva lokucwiliswa, njll. | ||
| Ukuqedwa kwendawo ekhethiwe | ENIG+Umunwe wegolide, I-Flash gold+munwe wegolide | ||
| Uhlobo Lwezinto | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, njll. | Futhi kungaba ukuthenga izinto zokwakha njengoba isicelo | |
| I-copper foil | 1/3oz ~ 10oz | ||
| Prepreg Type | I-FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, njll. | |
| Ukuhlolwa Okuthembekile | Amandla e-peel | 7.8N/cm | |
| I-Fammability | 94V-0 | ||
| Ukungcola kwe-Ionic | ≤1ug/cm² | ||
| Okuncane.ubukhulu be-dielectric | 0.075mm(3mil) | ||
| Ukubekezelelana kwe-impedance | +/-10%, iminithi ingakwazi ukulawula +/- 7% | ||
| Isendlalelo sangaphakathi&Ukudluliswa kwesithombe sesendlalelo sangaphandle | Amandla Omshini | Umshini Wokukhuhla | Ubukhulu bezinto: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Usayizi wezinto ezibonakalayo: min.228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Ubukhulu bezinto: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Usayizi wempahla: min 203 x 203mm(8 x 8"), ubuningi 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Ubukhulu bezinto: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Usayizi wezinto ezibonakalayo: min.177 x 177mm(7 x 7") | |||
| Ikhono Lokucubungula isendlalelo sangaphakathi | Okuncane.ububanzi/isikhala somugqa wangaphakathi | 0.075/0.075mm(3/3mil) | |
| Okuncane.isikhala kusuka onqenqemeni lwembobo kuya ku-conductive | 0.2mm(8mil) | ||
| Okuncane.ungqimba lwangaphakathi indandatho annular | 0.1mm(4mil) | ||
| Okuncane.imvume yokuhlukanisa isendlalelo sangaphakathi | 0.25mm(10mil) okujwayelekile, 0.2mm(8mil) okuthuthukile | ||
| Okuncane.isikhala kusuka onqenqemeni lwebhodi kuya ku-conductive | 0.2mm(8mil) | ||
| Okuncane.ububanzi begebe phakathi komhlabathi wethusi | 0.127mm(5mil) | ||
| Ungalinganisi ukujiya kwethusi komgogodla wangaphakathi | H/1oz, 1/2oz | ||
| Ubukhulu.ugqinsi lwethusi oluphelile | 10oz | ||
| Amandla Wenqubo Yesendlalelo Sangaphandle | Okuncane.ububanzi bomugqa wangaphandle/isikhala | 0.075/0.075mm(3/3mil) | |
| Okuncane.usayizi wephedi lomgodi | 0.3mm(12mil) | ||
| Amandla okucubungula | Ubukhulu.slot usayizi wamatende | 5 x 3mm(196.8 x 118mil) | |
| Ubukhulu.usayizi wembobo yamatende | 4.5mm(177.2mil) | ||
| Okuncane.ububanzi bomhlaba wamatende | 0.2mm(8mil) | ||
| Okuncane.indandatho yonyaka | 0.1mm(4mil) | ||
| Okuncane.Inani eliphakeme kakhulu lama-BGA | 0.5mm(20mil) | ||
| I-AOI | Amandla Omshini | I-Orbotech SK-75 AOI | Ugqinsi lwezinto: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Usayizi wezinto ezibonakalayo: max.597 ~ 597mm(23.5 x 23.5") | |||
| Umshini we-Orbotech Ves | Ugqinsi lwezinto: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Usayizi wezinto ezibonakalayo: max.597 ~ 597mm(23.5 x 23.5") | |||
| Ukubhoboza | Amandla Omshini | MT-CNC2600 Drill umshini | Ubukhulu bezinto: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Usayizi wezinto ezibonakalayo: max.470 ~ 660mm(18.5 x 26") | |||
| Okuncane.usayizi wokubhoboza: 0.2mm(8mil) | |||
| Amandla okucubungula | Okuncane.multi-hit drill bit usayizi | 0.55mm(21.6mil) | |
| Ubukhulu.i-aspect ratio(usayizi webhodi oqediwe usayizi we-VS Drill) | 12:01 | ||
| Ukubekezelelwa kwendawo eyimbobo (uma kuqhathaniswa ne-CAD) | +/-3mil | ||
| Imbobo ye-Counterbore | I-PTH&NPTH, I-engeli ephezulu ingu-130°, Ububanzi obuphezulu <6.3mm | ||
| Okuncane.isikhala kusuka onqenqemeni lwembobo kuya ku-conductive | 0.2mm(8mil) | ||
| Ubukhulu.drill bit size | 6.5mm(256mil) | ||
| Okuncane.multi-hit slot usayizi | 0.45mm(17.7mil) | ||
| Ukubekezelela usayizi wezimbobo zokulingana kokucindezela | +/-0.05mm(+/-2mil) | ||
| Okuncane.PTH slot size ukubekezelelana | +/-0.15mm(+/-6mil) | ||
| Okuncane.NPTH slot usayizi ukubekezelelana | +/-2mm(+/-78.7mil) | ||
| Okuncane.isikhala ukusuka onqenqemeni lwembobo ukuya ku-conductive (i-Blind vias) | 0.23mm(9mil) | ||
| Okuncane.usayizi we-laser drill | 0.1mm(+/-4mil) | ||
| I-countersink hole angle&Diameter | Okuphezulu okungu-82,90,120° | ||
| Inqubo Emanzi | Amandla Omshini | Iphaneli & Umugqa wokucwenga wephethini | Ubukhulu bezinto: 0.2 ~ 7.0mm(8 ~276mil) |
| Usayizi wezinto ezibonakalayo: max.610 x 762mm(24 x 30") | |||
| I-Deburring Maching | Ubukhulu bezinto: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Usayizi wezinto ezibonakalayo: min.203 x 203mm(8" x 8") | |||
| I-Desmear Line | Ubukhulu bezinto: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Usayizi wezinto ezibonakalayo: max.610 x 762mm(24 x 30") | |||
| Ulayini wokufaka ithini | Ubukhulu bezinto: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Usayizi wezinto ezibonakalayo: max.610 x 762mm(24 x 30") | |||
| Amandla okucubungula | Imbobo yodonga lwethusi ukujiya | isilinganiso esingu-25um(1mil) esijwayelekile | |
| Iqedile ukujiya kwethusi | ≥18um(0.7mil) | ||
| Ububanzi bomugqa omncane wokumaka wokufaka | 0.2mm(8mil)) | ||
| I-Max.iqedele isisindo sethusi sezendlalelo zangaphakathi nangaphandle | 7oz | ||
| Ugqinsi lwethusi oluhlukene | H/1oz,1/2oz | ||
| I-Solder Mask & Silkscreen | Amandla Omshini | Umshini Wokukhuhla | Ubukhulu bezinto: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Usayizi wezinto ezibonakalayo: min.228 x 228mm(9 x 9") | |||
| Umchazi | Ubukhulu bezinto: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Usayizi wezinto ezibonakalayo: max.635 x 813mm(25 x 32") | |||
| Thuthukisa umshini | Ubukhulu bezinto: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Usayizi wezinto ezibonakalayo: min.101 x 127mm(4 x 5") | |||
| Umbala | Umbala wemaski we-Solder | Okuluhlaza okotshani, okuluhlaza okotshani, okuphuzi, okumnyama, okuluhlaza okwesibhakabhaka, okubomvu, okumhlophe | |
| Umbala wesikrini sikasilika | Okumhlophe, okuphuzi, okumnyama, okuluhlaza okwesibhakabhaka | ||
| I-Solder Mask Amandla | Okuncane.ukuvula imaski ye-solder | 0.05mm(2mil) | |
| Ubukhulu.ixhunywe ngosayizi | 0.65mm(25.6mil) | ||
| Okuncane.ububanzi bokufakwa komugqa nge-S/M | 0.05mm(2mil) | ||
| Okuncane.I-solder mask legends ububanzi | 0.2mm(8mil) okujwayelekile, 0.17mm(7mil) okuthuthukile | ||
| Okuncane.ukujiya kwemaski ye-solder | 10um(0.4mil) | ||
| Ubukhulu bemaski ye-solder nge-tenting | 10um(0.4mil) | ||
| Okuncane.I-carbon oil line ububanzi/isikhala | 0.25/0.35mm(10/14mil) | ||
| Okuncane.umkhondo we-carbon | 0.06mm(2.5mil) | ||
| Okuncane.carbon oil line trace | 0.3mm(12mil)) | ||
| Okuncane.isikhala kusuka ku-carbon pattern kuya kuma-pads | 0.25mm(10mil) | ||
| Okuncane.ububanzi bomugqa wekhava yemaski e peelable/iphedi | 0.15mm(6mil) | ||
| Okuncane.I-solder mask ibhuloho ububanzi | 0.1mm(4mil)) | ||
| I-solder mask Ukuqina | 6H | ||
| Amandla Wemaski Acwengeka | Okuncane.isikhala kusuka kuphethini yemaski e peelable kuya kuphedi | 0.3mm(12mil)) | |
| Ubukhulu.usayizi wembobo yetende lemaski exebuka (Ngokuphrinta isikrini) | 2mm(7.8mil) | ||
| Ubukhulu.usayizi wembobo yetende lemaski exebuka (Ngokuphrinta kwe-aluminium) | 4.5mm | ||
| Ubukhulu bemaski obucwengeka | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Ikhono le-Silkscreen | Okuncane.ububanzi bomugqa we-silkscreen | 0.11mm(4.5mil) | |
| Okuncane.ubude bomugqa we-silkscreen | 0.58mm(23mil) | ||
| Okuncane.isikhala kusuka kunganekwane kuya kuphedi | 0.17mm(7mil) | ||
| I-Surface Qeda | Surface Qeda Amandla | Ubukhulu.ubude bomunwe wegolide | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) igolide | ||
| umunwe wegolide | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) igolide | ||
| I-HASL | 0.4um(0.016mil) Sn/Pb | ||
| Umshini we-HASL | Ubukhulu bezinto: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Usayizi wempahla: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Ucwecwe lwegolide eliqinile | 1-5u" | ||
| I-Tin yokucwiliswa | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Ithini | ||
| Isiliva Sokucwiliswa | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| I-E-Test | Amandla Omshini | Umhloli ondizayo we-probe | Ubukhulu bezinto: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Usayizi wezinto ezibonakalayo: max.498 x 597mm(19.6 ~ 23.5") | |||
| Okuncane.isikhala kusuka kuphedi yokuhlola ukuya emaphethelweni ebhodi | 0.5mm(20mil) | ||
| Okuncane.ukumelana conductive | 5Ω | ||
| Ubukhulu.ukumelana ne-insulation | 250mΩ | ||
| Ubukhulu.i-voltage yokuhlola | 500V | ||
| Okuncane.usayizi wephedi lokuhlola | 0.15mm(6mil)) | ||
| Okuncane.i-test pad to pad space | 0.25mm(10mil) | ||
| Ubukhulu.isivivinyo samanje | 200mA | ||
| Ukwenza iphrofayela | Amandla Omshini | Uhlobo lwephrofayela | NC umzila, V-cut, slot amathebhu, imbobo isitembu |
| Umshini wokuthungatha we-NC | Ubukhulu bezinto: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Usayizi wezinto ezibonakalayo: max.546 x 648mm(21.5 x 25.5") | |||
| Umshini wokusika i-V | Ubukhulu bezinto: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Ububanzi bempahla obukhulu be-V-cut: 457mm(18") | |||
| Amandla okucubungula | Okuncane.usayizi webhithi yomzila | 0.6mm(23.6mil) | |
| Okuncane.chaza ukubekezelelana | +/-0.1mm(+/-4mil) | ||
| Uhlobo lwe-engeli ye-V-cut | 20°, 30°, 45°, 60° | ||
| Ukubekezelela i-engeli ye-V-cut | +/-5° | ||
| Ukubekezelela ukubhaliswa kwe-V-cut | +/-0.1mm(+/-4mil) | ||
| Okuncane.iminwe yegolide isikhala | +/-0.15mm(+/-6mil) | ||
| Ukubekezelela i-engeli ye-Bevelling | +/-5° | ||
| I-Bevelling ihlala ibekezelela ukushuba | +/-0.127mm(+/-5mil) | ||
| Okuncane.irediyasi yangaphakathi | 0.4mm(15.7mil) | ||
| Okuncane.isikhala kusuka ku-conductive kuya kuhlaka | 0.2mm(8mil) | ||
| Ukubekezelela ukujula kwe-Countersink/Counterbore | +/-0.1mm(+/-4mil) | ||