Ngemva kokuklama i-Ibhodi le-PCB, sidinga ukukhetha inqubo yokwelashwa kwendawo yebhodi lesifunda.Izinqubo ezisetshenziswa kakhulu zokwelashwa kwendawo yebhodi lesifunda yi-HASL (inqubo yokufafaza ithini elingaphezulu), i-ENIG (inqubo yokucwiliswa kwegolide), i-OSP (inqubo yokulwa ne-oxidation), kanye nendawo evame ukusetshenziswa Kufanele siyikhethe kanjani inqubo yokwelapha?Izinqubo ezihlukene zokwelapha indawo ye-PCB zinezindleko ezihlukene, futhi imiphumela yokugcina nayo ihlukile.Ungakhetha ngokuvumelana nesimo sangempela.Ake ngikutshele mayelana nezinzuzo kanye nokubi kwezinqubo ezintathu ezihlukene zokwelashwa kwendawo: i-HASL, i-ENIG, ne-OSP.
1. I-HASL (inqubo yokufafaza ithini elingaphezulu)
Inqubo yokufutha ngothayela ihlukaniswe ngethini lesifutho somthofu nesifutho sethayela elingenamthofu.Inqubo yokufutha ngothayela kwakuyinqubo yokwelapha engaphezulu ebaluleke kakhulu ngeminyaka yawo-1980.Kodwa manje, amabhodi esekethe ambalwa nambalwa akhetha inqubo yesifutho sikathayela.Isizathu siwukuthi ibhodi lesifunda endaweni "encane kodwa enhle kakhulu".Inqubo ye-HASL izoholela kumabhola ampofu we-solder, ingxenye ye-ball point tin ebangelwa lapho i-welding emihleIzinsizakalo ze-PCB Assemblyisitshalo ukuze ufune amazinga aphezulu kanye nobuchwepheshe bekhwalithi yokukhiqiza, izinqubo zokwelashwa kwe-ENIG kanye ne-SOP zivame ukukhethwa.
Izinzuzo zamathini afafazwe ngomthofu : intengo ephansi, ukusebenza kahle kakhulu kwe-welding, amandla angcono emishini kanye nokucwebezela kunethayela elifafazwe ngomthofu.
Ububi bethayela elifafazwe ngomthofu: Ithini elifuthwe ngomthofu liqukethe izinsimbi ezisindayo zomthofu, ezingahambisani nemvelo ekukhiqizeni futhi ezingakwazi ukudlulisa ukuhlolwa kokuvikelwa kwemvelo okufana ne-ROHS.
Izinzuzo zokufafaza ngamathini angenamthofu: intengo ephansi, ukusebenza okuhle kakhulu kwe-welding, futhi kunobungani bemvelo, kungadlula i-ROHS nokunye ukuhlola kokuvikelwa kwemvelo.
Ukungalungi kwesifutho sethini esingenamthofu: Amandla emishini kanye nokucwebezela akukuhle njengesifutho sikathayela esingenamthofu.
Ukungalungi okuvamile kwe-HASL: Ngenxa yokuthi indawo ephansi yebhodi efakwe nge-tin ayilungile, ayifaneleki izikhonkwane zokuhlanganisa ezinezikhala ezinhle kanye nezingxenye ezincane kakhulu.Ubuhlalu bethayela bukhiqizwa kalula ekucutshungulweni kwe-PCBA, okungenzeka ukuthi kubangele amasekhethi amafushane ezingxenyeni ezinezikhala ezinhle.
2. ENIG(Inqubo yokucwilisa igolide)
Inqubo yokucwilisa igolide iyinqubo ethuthukisiwe yokwelashwa kwendawo, esetshenziswa kakhulu kumabhodi esekethe anezidingo zokuxhuma okusebenzayo kanye nezikhathi zokulondoloza isikhathi eside phezulu.
Izinzuzo ze-ENIG: Akulula ukwenza i-oxidize, ingagcinwa isikhathi eside, futhi inendawo eyisicaba.Ilungele ukuhlanganisa izikhonkwane ze-fine-gap kanye nezingxenye ezinamajoyini amancane e-solder.Ukugeleza kabusha kungaphinda izikhathi eziningi ngaphandle kokunciphisa ukuthengiselana kwayo.Ingasetshenziswa njenge-substrate ye-COB wire bonding.
Ukungalungi kwe-ENIG: Izindleko eziphezulu, amandla okushisela ampofu.Ngenxa yokuthi kusetshenziswa inqubo ye-electroless nickel plating, kulula ukuba nenkinga yediski emnyama.Ungqimba lwe-nickel luba ne-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside kuyinkinga.
3. I-OSP (inqubo ye-anti-oxidation)
I-OSP iyifilimu ephilayo eyakhiwe ngamakhemikhali phezu kwethusi elingenalutho.Le filimu ine-anti-oxidation, ukumelana nokushisa nomswakama, futhi isetshenziselwa ukuvikela indawo yethusi ekugqwaleni (i-oxidation noma i-vulcanization, njll.) endaweni evamile, okulingana nokwelashwa kwe-anti-oxidation.Kodwa-ke, ekushiseni okuphezulu okulandelayo kwe-solder, ifilimu evikelayo kufanele isuswe kalula yi-flux, futhi indawo yethusi ehlanzekile eveziwe ingahlanganiswa ngokushesha ne-solder encibilikisiwe ukuze ihlanganise i-solder eqinile ngesikhathi esifushane kakhulu.Njengamanje, inani lamabhodi wesifunda asebenzisa inqubo yokwelashwa kwe-OSP ebusweni liye landa kakhulu, ngoba le nqubo ifanele amabhodi wesifunda asezingeni eliphansi kanye namabhodi wesifunda zobuchwepheshe.Uma ingekho imfuneko yokusebenza koxhumano olungaphezulu noma umkhawulo wesikhathi sokulondoloza, inqubo ye-OSP iyoba inqubo yokwelapha engaphezulu efaneleke kakhulu.
Izinzuzo ze-OSP:Inazo zonke izinzuzo ze-welding yethusi engenalutho.Ibhodi eliphelelwe yisikhathi (izinyanga ezintathu) lingabuye livuselelwe, kodwa ngokuvamile lilinganiselwe ngesikhathi esisodwa.
Ukungalungi kwe-OSP:I-OSP isengozini yokuthola i-asidi nomswakama.Uma isetshenziselwa ukuthengiswa kwe-reflow yesibili, idinga ukuqedwa phakathi nenkathi ethile yesikhathi.Ngokuvamile, umphumela we-solder ye-reflow yesibili uzoba mubi.Uma isikhathi sokugcina sidlula izinyanga ezintathu, kufanele sivuswe kabusha.Sebenzisa kungakapheli amahora angama-24 ngemuva kokuvula iphakheji.I-OSP iwungqimba oluvikelayo, ngakho-ke iphoyinti lokuhlola kufanele liphrintwe ngokunamathisela kwe-solder ukuze kukhishwe isendlalelo sokuqala se-OSP ukuze kuthinte indawo yokukhonjwa ukuze kuhlolwe ugesi.Inqubo yokuhlanganisa idinga izinguquko ezinkulu, ukuhlola indawo yethusi eluhlaza kuyingozi ku-ICT, ama-ICT anamaphuzu amaningi angalimaza i-PCB, adinge izinyathelo zokuphepha ezenziwa ngesandla, ukunciphisa ukuhlolwa kwe-ICT futhi kunciphise ukuphindaphinda kokuhlolwa.
Okungenhla ukuhlaziya inqubo yokwelashwa okungaphezulu kwamabhodi wesifunda we-HASL, ENIG kanye ne-OSP.Ungakhetha inqubo yokwelashwa kwendawo ozoyisebenzisa ngokusho kokusetshenziswa kwangempela kwebhodi lesifunda.
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Isikhathi sokuthumela: Jan-31-2022