Enqubweni yokukhiqiza yePCB umhlangano amabhodi wesifunda, akunakugwenywa ukuthi kuzoba namaphutha e-welding kanye nokukhubazeka kokubukeka.Lezi zici zizodala ingozi encane ebhodini lesifunda.Namuhla, lesi sihloko sethula ngokuningiliziwe izici ezivamile zokushisela, izici zokubukeka, izingozi nezimbangela ze-PCBA.Ake siyibheke Ihlole!
I-Pseudo Soldering
Izici zokubukeka:kukhona umngcele omnyama osobala phakathi kwe-solder kanye nokuhola kwezingxenye noma i-foil yethusi, futhi i-solder ishonele ngasemngceleni.
Ingozi:ayikwazi ukusebenza ngokujwayelekile.
Ukuhlaziya imbangela:
1.Izingxenye zokuhola azihlanzwa, amathini ahlanganiswe noma afakwe i-oxidized.
2.Ibhodi eliphrintiwe alihlanzwa kahle, futhi ikhwalithi ye-flux efuthwe ayilungile.
Ukuqoqwa kwe-solder
Izici zokubukeka:Isakhiwo esihlangene solder sikhululekile, simhlophe futhi sifiphele.
Ukuhlaziywa kwembangela:
1.Ikhwalithi ye-solder ayilungile.
I-2.Izinga lokushisa le-soldering alanele.
I-3.Lapho i-solder ingaqinisiwe, ingxenye eholayo ikhululekile.
I-solder eningi kakhulu
Izici zokubukeka:Ingaphezulu le-solder liyi-convex.
Izingozi:I-waste solder futhi ingase ibe nokukhubazeka.
Ukuhlaziya imbangela:Ukukhishwa kwesoda sekwephuzile kakhulu.
I-solder encane kakhulu
Izici zokubukeka:Indawo ye-welding ingaphansi kwama-80% we-pad, futhi i-solder ayenzi indawo eguquguqukayo ebushelelezi.
Ingozi:Amandla emishini anganele.
Ukuhlaziywa kwembangela:
1.Ukugeleza kwe-solder okungalungile noma ukukhishwa ngaphambi kwesikhathi kwe-solder.
2.Ukuguquguquka okunganele.
3.Isikhathi sokushisela sifushane kakhulu.
I-Rosin Welding
Izici zokubukeka:Kukhona i-rosin slag endaweni yokushisela.
Izingozi:Amandla anganele, ukungahambi kahle kahle, futhi ingase ivule futhi ivaliwe.
Ukuhlaziywa kwembangela:
1.Imishini yokushisela eminingi kakhulu noma yehlulekile.
2.Isikhathi sokushisela esinganele kanye nokushisa okunganele.
3.Ifilimu ye-oxide engaphezulu ayisuswa.
Ukushisa ngokweqile
Izici zokubukeka:amalunga amhlophe e-solder, akukho luster metallic, indawo emangelengele.
Ingozi:I-pad kulula ukuyikhipha futhi amandla ayancipha.
Ukuhlaziya imbangela:
Amandla ensimbi yokunamathisela makhulu kakhulu futhi isikhathi sokushisisa side kakhulu.
Ukushisela okubandayo
Izici zokubukeka:Ingaphezulu liyizinhlayiya ezifana ne-curd, futhi ngezinye izikhathi kungase kube nokuqhekeka.
Ingozi:amandla aphansi, ukungasebenzi kahle kukagesi.
Ukuhlaziya imbangela:Kukhona i-jitter ngaphambi kokuba i-solder iqiniswe.
Ukungenwa kahle
Izici zokubukeka:I-interface phakathi kwe-solder ne-weldment inkulu kakhulu futhi ayibushelelezi.
Ingozi:ukuqina okuphansi, akukho ukuxhumana noma ukuxhumana okuphakathi.
Ukuhlaziywa kwembangela:
1.I-weldment ayihlanzekile.
2.Ukuguquguquka kwekhwalithi enganele noma empofu.
3.Ama-Weldments awashisi ngokwanele.
I-asymmetrical
Izici zokubukeka:I-solder ayigelezi ku-pad.
Ingozi:Amandla anganele.
Ukuhlaziywa kwembangela:
1.I-solder fluidity ayilungile.
2.Ukuguquguquka kwekhwalithi enganele noma empofu.
3.Ukushisa okunganele.
khulula
Izici zokubukeka:Izintambo noma izingxenye zokuhola zingasuswa.
Ingozi:ukuhamba kahle noma okungekho.
Ukuhlaziywa kwembangela:
I-1.I-lead ihamba ngaphambi kokuba i-solder iqine, ibangele i-voids.
2.Imithofu ayilungiswanga kahle (impofu noma ayimanziswanga).
Ukulola
Izici zokubukeka:Ukubukeka kwethiphu.
Ingozi:ukubukeka kabi, kulula ukubangela i-bridging phenomenon.
Ukuhlaziywa kwembangela:
1.Ukuguquguquka okuncane kakhulu nesikhathi eside sokushisa.
I-2.I-angle ye-solder iron ukuze ihoxiswe ayilungile.
Ukubhula
Izici zokubukeka:Izintambo eziseduze zixhunyiwe.
Ingozi:Isifunda esifushane sikagesi.
Ukuhlaziywa kwembangela:
1.I-solder eningi kakhulu.
I-2.I-angle ye-solder iron ukuze ihoxiswe ayilungile.
umgodi wokucasha
Izici zokubukeka:Kunezimbobo ezibonakalayo ngokuhlola okubonakalayo noma ngokukhuliswa okuphansi.
Ingozi:Amandla anganele, amalunga e-solder kulula ukugqwala.
Ukuhlaziya imbangela:Igebe phakathi komthofu nembobo yephedi likhulu kakhulu.
Ibhamuza
Izici zokubukeka:Umsuka womthofu uneqhubu le-solder eliphefumula umlilo, futhi kukhona umgodi ngaphakathi.
Ingozi:Ukuqhutshwa kwesikhashana, kodwa kulula ukubangela ukungahambi kahle isikhathi eside.
Ukuhlaziywa kwembangela:
1.Igebe phakathi komthofu nembobo yephedi likhulu.
2.Ukumanzisa umthofu ompofu.
I-3.Isikhathi sokushisela ibhodi elinamaceleni amabili ngokusebenzisa izimbobo side, futhi umoya emigodini uyakhula.
Iphoyisai-foil ngayinye iphakanyisiwe
Izici zokubukeka:I-foil yethusi ihlutshiwe ebhodini eliphrintiwe.
Ingozi:Ibhodi eliphrintiwe lonakele.
Ukuhlaziya imbangela:Isikhathi sokushisela side kakhulu futhi izinga lokushisa liphezulu kakhulu.
Ikhasi
Izici zokubukeka:Amalunga e-solder ahlutshiwe ku-foil yethusi (hhayi i-copper foil kanye nebhodi eliphrintiwe).
Ingozi:Vula isifunda.
Ukuhlaziya imbangela:Ukufakwa kwensimbi okungekuhle kuphedi.
Ngemva kokuhlaziywa kwezimbangela zePCB umhlangano solderingamaphutha, sinethemba lokukunikeza inhlanganisela engcono kakhuluisevisi yokuhlanganisa ukhiye we-PCB, ikhwalithi, intengo kanye nesikhathi sokudiliva ku-oda lakho leqoqo le-PCB leqoqwana elincane le-Mid batch Volume PCB oda lomhlangano.
Uma ufuna umkhiqizi womhlangano we-PCB okahle, sicela uthumele amafayela akho e-BOM namafayela e-PCB ku sales@pcbfuture.com.Wonke amafayela akho ayimfihlo kakhulu.Sizokuthumelela isilinganiso esinembile nesikhathi sokuhola emahoreni angama-48.
Isikhathi sokuthumela: Oct-09-2022