1, Ukulinganisa kwe-solder yomoya oshisayo
Ibhodi lesiliva libizwa nge-tin hot air solder leveling board.Ukufafaza ungqimba lukathayela ongqimbeni olungaphandle lwesekethe yethusi kuyahambisana nokushisela.Kodwa ayikwazi ukunikeza ukuthembeka kokuxhumana kwesikhathi eside njengegolide.Uma uyisebenzisa isikhathi eside kakhulu, kulula ukwenza i-oxidize nokugqwala, okuholela ekuxhumaneni okubi.
Izinzuzo:Intengo ephansi, ukusebenza kahle kwe-welding.
Ububi:I-flatness engaphezulu yebhodi yokulinganisa i-hot air solder ayilungile, engafaneleki izikhonkwane zokushisela ezinegebe elincane kanye nezingxenye ezincane kakhulu.Ubuhlalu bethayela kulula ukukhiqiza kuboUkucutshungulwa kwe-PCB, okulula ukubangela isifunda esifushane ezingxenyeni ezincane zephini le-gap.Uma isetshenziswa kunqubo ye-SMT enezinhlangothi ezimbili, kulula kakhulu ukufafaza ukuncibilika kwe-tin, okuholela ebuhlalu bethayela noma amachashazi ayindilinga, okuholela endaweni engalingani kakhulu futhi kuthinte izinkinga zokushisela.
2, Isiliva lokucwiliswa
Inqubo yesiliva yokucwiliswa ilula futhi iyashesha.Isiliva lokucwiliswa liwukusabela kokugudluka, okucishe kube yi-submicron eyisiliva emsulwa (5~15 μ In, cishe ngo-0.1~0.4 μ m) Kwesinye isikhathi inqubo yokucwiliswa kwesiliva nayo iqukethe ezinye izinto eziphilayo, ikakhulukazi ukuvimbela ukugqwala kwesiliva nokuqeda inkinga. yokufuduka kwesiliva Ngisho noma ichayeke ekushiseni, kumswakama kanye nokungcola, isengakwazi ukunikeza izakhiwo ezinhle zikagesi futhi igcine ukushisela okuhle, kodwa izolahlekelwa ukucwebezela.
Izinzuzo:Indawo ye-welding yesiliva ene-weldability enhle ne-coplanarity.Ngesikhathi esifanayo, ayinazo izithiyo zokuqhuba njenge-OSP, kodwa amandla ayo awekho njengegolide uma isetshenziswa njengendawo yokuxhumana.
Ububi:Uma uvezwa endaweni emanzi, isiliva lizokhiqiza ukufuduka kwe-electron ngaphansi kwesenzo se-voltage.Ukwengeza izingxenye ze-organic esiliva kunganciphisa inkinga yokufuduka kwama-electron.
3, Ithini lokucwiliswa
Ithini lokucwiliswa lisho i-solder wicking.Esikhathini esedlule, i-PCB yayijwayele ukuba nentshebe emva kwenqubo ye-Immersion tin.Amadevu kathayela kanye nokufuduka kwethini ngesikhathi sokushisela kuzonciphisa ukuthembeka.Ngemuva kwalokho, izithasiselo eziphilayo zengezwa kwisisombululo sokucwiliswa kwe-tin, ukuze isakhiwo sesendlalelo se-tin sibe yi-granular, esinqoba izinkinga zangaphambilini, futhi sibe nokuzinza okuhle kokushisa kanye nokushisela.
Ububi:Ubuthakathaka obukhulu bokucwiliswa kwethini impilo yayo yesevisi emfushane.Ikakhulukazi uma igcinwe endaweni yokushisa ephezulu kanye nemvelo enomswakama ophezulu, izinhlanganisela phakathi kwezinsimbi ze-Cu/Sn zizoqhubeka zikhula zize zilahlekelwe ukudaleka.Ngakho-ke, amapuleti afakwe ngothayela awakwazi ukugcinwa isikhathi eside kakhulu.
Siyazethemba ekukunikezeni inhlanganisela engcono kakhuluisevisi yomhlangano we-turnkey PCB, ikhwalithi, intengo kanye nesikhathi sokulethwa ku-oda lakho leqoqo le-PCB leqoqwana elincane le-Mid batch Volume PCB oda lomhlangano.
Uma ufuna umkhiqizi womhlangano we-PCB okahle, sicela uthumele amafayela akho e-BOM namafayela e-PCB kusales@pcbfuture.com.Wonke amafayela akho ayimfihlo kakhulu.Sizokuthumelela isilinganiso esinembile nesikhathi sokuhola emahoreni angama-48.
Isikhathi sokuthumela: Nov-21-2022